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BEGIN:VEVENT
ORGANIZER;CN="Hunter, Tiffany":mailto:huntert1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=ghavamibeh
nam@gmail.com:mailto:ghavamibehnam@gmail.com
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Abukamail,
Nasseef":mailto:abukamai@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Allwine, D
aniel":mailto:allwined@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Bartone, C
hris":mailto:bartone@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Chenji, Ha
rsha":mailto:chenji@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Goble, Jam
es":mailto:goble@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Irwin, Den
nis":mailto:irwind@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Jadwisienc
zak, Wojciech":mailto:jadwisie@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Karanth, A
vinash":mailto:karanth@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Kaya, Sava
s":mailto:kaya@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Kelsey, Ra
lph":mailto:kelsey@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Liu, Chang"
:mailto:liuc@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Liu, Jundo
ng":mailto:liuj1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Mourning,
Chad":mailto:mourning@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ostermann,
Shawn":mailto:osterman@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Rahman, Fa
iz":mailto:rahmanf@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Schlicher,
Jared":mailto:schliche@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ugazio, Sa
brina":mailto:ugazio@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Vasiliadis
, Konstantinos":mailto:vassilia@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Welch, Lon
nie":mailto:welch@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Zhu, Jim":m
ailto:zhuj@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Wang, Zhew
ei":mailto:wangz1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Lindner, P
atricia":mailto:lindnerp@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ardrey, Gr
egory":mailto:gardrey@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Yadav, Ani
mesh":mailto:yadava@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Plis, Kevi
n":mailto:plis@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Juedes, Da
vid":mailto:juedes@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Fox, Patri
ck":mailto:pfox@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Patterson,
James":mailto:pattersj@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Steinberg,
Eric":mailto:steinber@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_bscs@
listserv.ohio.edu:mailto:eecs_bscs@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_bsee@
listserv.ohio.edu:mailto:eecs_bsee@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_mscs@
listserv.ohio.edu:mailto:eecs_mscs@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_phd@l
istserv.ohio.edu:mailto:eecs_phd@listserv.ohio.edu
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listserv.ohio.edu:mailto:eecs_msee@listserv.ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Adebowale,
Quadri Ramon":mailto:qa506921@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ghauri, Ah
mad":mailto:ag592521@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Koranteng,
Osborn":mailto:ok939622@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Zhang, Yua
nhang":mailto:yz140212@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Barat, Aak
riti":mailto:ab613319@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Burchfield
, Makayla":mailto:mb069517@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Agyeman, A
mos":mailto:aa852712@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Mullett, D
rew":mailto:dm247120@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Leary, Abb
y":mailto:al409220@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Chauhan, S
aumya":mailto:sc357320@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Marusek, J
osh":mailto:jm553020@ohio.edu
ATTENDEE;ROLE=OPT-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Flaherty,
Aidan":mailto:af674321@ohio.edu
DESCRIPTION;LANGUAGE=en-US:Title:\n\nAI-Driven EDA: Transforming Chip Desig
n for Performance\, Cost Efficiency\, and Reliability\n\n\n\nBio: Behnam G
havami earned his Ph.D. in Computer Engineering from Amirkabir University
of Technology in 2012. Following his doctoral studies\, he served as an As
sistant/Associate Professor at the Department of Computer Engineering at S
hahid Bahonar University of Kerman in Iran from 2013 to 2019. After his ac
ademic tenure\, Behnam pursued a Postdoctoral Researcher position at the S
chool of Engineering Science\, Simon Fraser University\, in British Columb
ia\, Canada. Presently\, he holds the position of a postdoctoral researche
r in the Department of Electrical and Computer Engineering at the Universi
ty of British Columbia (UBC)\, concurrently serving as a Senior Member of
Technical Staff at AMD.\n\nBehnam's research expertise lies in electronic
design automation (EDA)\, with a particular emphasis on the dependability
and reliability of computer systems\, as well as adaptive computing system
s. He is deeply committed to harnessing Machine Learning (ML) techniques w
ithin EDA to enhance the efficiency of intricate tasks while emphasizing t
he reinforcement of hardware reliability and security within VLSI systems.
\n\n\n\nAbstract- The integration of artificial intelligence (AI) into ele
ctronic design automation (EDA) heralds a transformative era for chip desi
gn. This presentation explores the symbiotic relationship between AI-drive
n EDA and the evolution of chip design methodologies. Leveraging generativ
e AI and classical deep learning models\, EDA processes are poised to opti
mize chip performance\, efficiency\, and societal impact while bolstering
reliability and security. AI-driven EDA accelerates time to market\, reduc
es chip design costs\, and democratizes access to advanced semiconductor t
echnologies\, fostering innovation for a more inclusive and prosperous soc
iety. Furthermore\, Generative AI techniques pave the way for robust and s
ecure chip architectures. The incorporation of AI in EDA significantly imp
acts cost reduction\, making chip design more accessible and affordable fo
r diverse communities and industries. This talk elucidates how AI-driven E
DA is reshaping the landscape of chip design\, enabling high-performance\,
cost-efficient\, and reliable solutions that cater to the evolving needs
of the semiconductor industry.\n\n\n______________________________________
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