[Eecs_mscs] EECS Research Seminar Talk-AI-Driven EDA: Transforming Chip Design for Performance, Cost Efficiency, and Reliability

• Previous message: [Eecs_mscs] EECS Research Seminar Talk-Data-Driven Cyber-Physical Energy Systems
• Next message: [Eecs_mscs] EECS Research Seminar Talk-Graph Data Analytics for Secured and Reliable Energy Systems
• Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]

Title:

AI-Driven EDA: Transforming Chip Design for Performance, Cost Efficiency, and Reliability


Bio: Behnam Ghavami earned his Ph.D. in Computer Engineering from Amirkabir University of Technology in 2012. Following his doctoral studies, he served as an Assistant/Associate Professor at the Department of Computer Engineering at Shahid Bahonar University of Kerman in Iran from 2013 to 2019. After his academic tenure, Behnam pursued a Postdoctoral Researcher position at the School of Engineering Science, Simon Fraser University, in British Columbia, Canada. Presently, he holds the position of a postdoctoral researcher in the Department of Electrical and Computer Engineering at the University of British Columbia (UBC), concurrently serving as a Senior Member of Technical Staff at AMD.

Behnam's research expertise lies in electronic design automation (EDA), with a particular emphasis on the dependability and reliability of computer systems, as well as adaptive computing systems. He is deeply committed to harnessing Machine Learning (ML) techniques within EDA to enhance the efficiency of intricate tasks while emphasizing the reinforcement of hardware reliability and security within VLSI systems.



Abstract- The integration of artificial intelligence (AI) into electronic design automation (EDA) heralds a transformative era for chip design. This presentation explores the symbiotic relationship between AI-driven EDA and the evolution of chip design methodologies. Leveraging generative AI and classical deep learning models, EDA processes are poised to optimize chip performance, efficiency, and societal impact while bolstering reliability and security. AI-driven EDA accelerates time to market, reduces chip design costs, and democratizes access to advanced semiconductor technologies, fostering innovation for a more inclusive and prosperous society. Furthermore, Generative AI techniques pave the way for robust and secure chip architectures. The incorporation of AI in EDA significantly impacts cost reduction, making chip design more accessible and affordable for diverse communities and industries. This talk elucidates how AI-driven EDA is reshaping the landscape of chip design, enabling high-performance, cost-efficient, and reliable solutions that cater to the evolving needs of the semiconductor industry.


________________________________________________________________________________
Microsoft Teams meeting
Join on your computer, mobile app or room device
Click here to join the meeting< https://teams.microsoft.com/l/meetup-join/19%3ameeting_YzFjMzhhYzktMmJlZi00MzVjLWFjY2EtZTc2N2ExMzcxMTkz%40thread.v2/0?context=%7b%22Tid%22%3a%22f3308007-477c-4a70-8889-34611817c55a%22%2c%22Oid%22%3a%22685c3f4f-29d5-4141-ada5-0fdeab8480e4%22%7d 
>
Meeting ID: 242 817 250 486
Passcode: hLNRvd
Download Teams< https://www.microsoft.com/en-us/microsoft-teams/download-app 
> | Join on the web< https://www.microsoft.com/microsoft-teams/join-a-meeting 
>
Or call in (audio only)
+1 614-706-6572,,531840495#<tel:+16147066572,,531840495#>   United States, Columbus
Phone Conference ID: 531 840 495#
Find a local number< https://dialin.teams.microsoft.com/8f5f7319-0053-4423-a154-4f8b6e7fb7dd?id=531840495 
> | Reset PIN< https://dialin.teams.microsoft.com/usp/pstnconferencing 
>
[ https://www.ohio.edu/sites/default/files/2018-11/invite_logo_teams.jpg 
]
If you encounter issues with this meeting, please visit the Help link. If you are not able to resolve the problems, please contact the meeting organizer to let them know you are having difficulty.
Learn More< https://aka.ms/JoinTeamsMeeting 
> | Help< https://www.ohio.edu/oit/services/collaboration/teams/help 
> | Meeting options< https://teams.microsoft.com/meetingOptions/?organizerId=685c3f4f-29d5-4141-ada5-0fdeab8480e4&tenantId=f3308007-477c-4a70-8889-34611817c55a&threadId=19_meeting_YzFjMzhhYzktMmJlZi00MzVjLWFjY2EtZTc2N2ExMzcxMTkz@thread.v2&messageId=0&language=en-US 
>
________________________________________________________________________________
-------------- next part --------------
An HTML attachment was scrubbed...
URL: < http://listserv.ohio.edu/pipermail/eecs_mscs/attachments/20240315/23729c8d/attachment.html 
>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: not available
Type: text/calendar
Size: 11014 bytes
Desc: not available
URL: < http://listserv.ohio.edu/pipermail/eecs_mscs/attachments/20240315/23729c8d/attachment.ics 
>

• Previous message: [Eecs_mscs] EECS Research Seminar Talk-Data-Driven Cyber-Physical Energy Systems
• Next message: [Eecs_mscs] EECS Research Seminar Talk-Graph Data Analytics for Secured and Reliable Energy Systems
• Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]