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BEGIN:VEVENT
ORGANIZER;CN="Hunter, Tiffany":mailto:huntert1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=ghavamibeh
nam@gmail.com:mailto:ghavamibehnam@gmail.com
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Abukamail,
Nasseef":mailto:abukamai@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Allwine, D
aniel":mailto:allwined@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Bartone, C
hris":mailto:bartone@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Chenji, Ha
rsha":mailto:chenji@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Goble, Jam
es":mailto:goble@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Irwin, Den
nis":mailto:irwind@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Jadwisienc
zak, Wojciech":mailto:jadwisie@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Karanth, A
vinash":mailto:karanth@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Kaya, Sava
s":mailto:kaya@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Kelsey, Ra
lph":mailto:kelsey@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Liu, Chang"
:mailto:liuc@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Liu, Jundo
ng":mailto:liuj1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Mourning,
Chad":mailto:mourning@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ostermann,
Shawn":mailto:osterman@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Rahman, Fa
iz":mailto:rahmanf@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Schlicher,
Jared":mailto:schliche@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ugazio, Sa
brina":mailto:ugazio@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Vasiliadis
, Konstantinos":mailto:vassilia@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Welch, Lon
nie":mailto:welch@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Zhu, Jim":m
ailto:zhuj@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Wang, Zhew
ei":mailto:wangz1@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Lindner, P
atricia":mailto:lindnerp@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Ardrey, Gr
egory":mailto:gardrey@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Yadav, Ani
mesh":mailto:yadava@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Plis, Kevi
n":mailto:plis@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Juedes, Da
vid":mailto:juedes@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Fox, Patri
ck":mailto:pfox@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Patterson,
James":mailto:pattersj@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN="Steinberg,
Eric":mailto:steinber@ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_bscs@
listserv.ohio.edu:mailto:eecs_bscs@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_bsee@
listserv.ohio.edu:mailto:eecs_bsee@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_mscs@
listserv.ohio.edu:mailto:eecs_mscs@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_phd@l
istserv.ohio.edu:mailto:eecs_phd@listserv.ohio.edu
ATTENDEE;ROLE=REQ-PARTICIPANT;PARTSTAT=NEEDS-ACTION;RSVP=TRUE;CN=eecs_msee@
listserv.ohio.edu:mailto:eecs_msee@listserv.ohio.edu
DESCRIPTION;LANGUAGE=en-US:Title:\n\nAI-Driven EDA: Transforming Chip Desig
n for Performance\, Cost Efficiency\, and Reliability\n\n\nBio: Behnam Gha
vami earned his Ph.D. in Computer Engineering from Amirkabir University of
Technology in 2012. Following his doctoral studies\, he served as an Assi
stant/Associate Professor at the Department of Computer Engineering at Sha
hid Bahonar University of Kerman in Iran from 2013 to 2019. After his acad
emic tenure\, Behnam pursued a Postdoctoral Researcher position at the Sch
ool of Engineering Science\, Simon Fraser University\, in British Columbia
\, Canada. Presently\, he holds the position of a postdoctoral researcher
in the Department of Electrical and Computer Engineering at the University
of British Columbia (UBC)\, concurrently serving as a Senior Member of Te
chnical Staff at AMD.\n\nBehnam's research expertise lies in electronic de
sign automation (EDA)\, with a particular emphasis on the dependability an
d reliability of computer systems\, as well as adaptive computing systems.
He is deeply committed to harnessing Machine Learning (ML) techniques wit
hin EDA to enhance the efficiency of intricate tasks while emphasizing the
reinforcement of hardware reliability and security within VLSI systems.\n
\n\n\nAbstract- The integration of artificial intelligence (AI) into elect
ronic design automation (EDA) heralds a transformative era for chip design
. This presentation explores the symbiotic relationship between AI-driven
EDA and the evolution of chip design methodologies. Leveraging generative
AI and classical deep learning models\, EDA processes are poised to optimi
ze chip performance\, efficiency\, and societal impact while bolstering re
liability and security. AI-driven EDA accelerates time to market\, reduces
chip design costs\, and democratizes access to advanced semiconductor tec
hnologies\, fostering innovation for a more inclusive and prosperous socie
ty. Furthermore\, Generative AI techniques pave the way for robust and sec
ure chip architectures. The incorporation of AI in EDA significantly impac
ts cost reduction\, making chip design more accessible and affordable for
diverse communities and industries. This talk elucidates how AI-driven EDA
is reshaping the landscape of chip design\, enabling high-performance\, c
ost-efficient\, and reliable solutions that cater to the evolving needs of
the semiconductor industry.\n\n\n________________________________________
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